Intel has unveiled the new desktop platform based on Rocket Lake CPU and motherboards equipped with Z590 and B560 chipsets, which brings with it several interesting new features.
The 11th generation Intel Cores will be the last to be made with a 14nm production process and will also be compatible with 400 series motherboards as well as Comet Lake, vice versa, they will be compatible with the 500 series given, obviously, common use of the LGA 1200 socket.
The new Cypress Cove architecture (a hybrid of Sunny Cove and Willow Cove design) will offer double digit IPC improvement over Skylake (19%), native support for DDR4 3200MHz, Intel Iris Xe integrated graphics, USB 3.2 Gen 2×2 from 20 Gbps, Thunderbolt 4 (USB4 compatible), Wi-Fi 6 and, finally, 20 PCI-E 4.0 lanes that will be added to those made available by the PCH Z590 and B560, the latter unlocked as regards the memory overclocking.
The offer will be declined on three CPU lines, namely Core i9, Core i7 and Core i5, with the flagship model, Core i9 11900K which, contrary to expectations, will stop at only 8 cores with HT and maximum frequency on a single 5.3GHz core.
Intel has released the first data about the performance in gaming, since this is the only area in which at the moment it can play with AMD, which seem slightly higher than what can be obtained using a Ryzen 9 5900X.
Moving on to the motherboards that have begun to peep out on the market, the ones that have most impressed us, once again, are the high-end proposals of ASUS and GIGABYTE, the first with its ROG MAXIMUS XIII EXTREME, EXTREME GLACIAL and HERO, the second with its Z590 AORUS XTREME and MASTER.
Given the energy demands of Rocket Lake, which not surprisingly stopped at 8 cores on the top of the range CPU, ASUS used an enhanced VRM (up to 18 + 2 phases) for its Z590 motherboards and equipped with a further improved cooling that makes use of generous heatsinks and hetapipes or an impressive liquid cooling system developed in collaboration with EK Water Blocks (EXTREME GLACIAL).
Particular care was also taken to keep the hot spirits of the latest generation PCIe Gen 4 SSDs at bay which, in the face of record-breaking performance, seem to heat up a lot, with their slots dissipated on three sides.
Not least GIGABYTE, which on its flagship AORUS has provided a VRM design with 20 + 1 phases of 100A each for an exorbitant total of 2100A in total, all cooled by two large heat sinks with aluminum fins (Fins Array II) and interconnected by a robust nickel-plated copper heatpipe (Direct Touch II).
The presence of an active cooling system under the upper cooling plate is not excluded.
AORUS ‘new Z590 boards utilize proprietary “XTREME MEMORY” technology which includes fully shielded tracks, DIMM slot anchor point soldering on both sides of the PCB using SMT Memory DIMM technology and tantalum polymer capacitor arrays to minimize all disturbances and electrical interference.
*The article has been translated based on the content of Nexthardware All by www.nexthardware.com. If there is any problem regarding the content, copyright, please leave a report below the article. We will try to process as quickly as possible to protect the rights of the author. Thank you very much!