TechInsights found a device that already has the company’s latest design.
A TechInsights according to his report, the Chinese YMTC (Yangtze Memory Technologies) is one of the first to mass-produce its 232-cell, TLC 3D NAND flash chip (X3-9070), which was unveiled back in August, and uses two NAND arrays, similar to competing solutions.
The development is based on the latest version 3.0 of the Xtacking architecture, and compared to its predecessor, this simplifies the complexity of the system, so the implementation of production can be more favorable.
(source: TechInsights) [+]
TechInsights found YMTC’s fresh design inside the 2 TB HikSemi CC700 SSD, and of course Micron, Samsung and SK Hynix are also working on a solution with a similar amount of cell layers, but the Chinese solution appeared the earliest in commercial data storage. Of course, this in itself is not a guarantee of success, but it can definitely be stated that the company in question has quickly become a challenger to the big ones since its establishment in 2016.
Source: Hírek és cikkek – PROHARDVER! by prohardver.hu.
*The article has been translated based on the content of Hírek és cikkek – PROHARDVER! by prohardver.hu. If there is any problem regarding the content, copyright, please leave a report below the article. We will try to process as quickly as possible to protect the rights of the author. Thank you very much!
*We just want readers to access information more quickly and easily with other multilingual content, instead of information only available in a certain language.
*We always respect the copyright of the content of the author and always include the original link of the source article.If the author disagrees, just leave the report below the article, the article will be edited or deleted at the request of the author. Thanks very much! Best regards!