TSMC will already test the 2nm production process this year

The first 3nm processors from the company TSMC we should wait for the launch of the Apple iPhone 15 Pro phones in the fall. But the company is already planning another one 2nm process, which should begin to be used from 2025. But this does not mean that the first batch of such chips will be produced then. As part of the verification of the new technology, the test production of the first 1000 2nm chips should take place much earlier, already this year. Further tuning of the process and tests of larger series should then take place next year.


According to TSMC, the production yield of 256Mb SRAM chips using the 2nm process should reach more than 50%. N2 PPA should bring a 10-15% increase in performance at the same consumption, or a 25-30% reduction in consumption at the same performance, against the N3E process. As for the transistor density, it should increase by 15%. The 2nm process will be TSMC’s first to use GAA (Gate-All-Around) technology. This should reduce leakage current against today’s FinFET and further improve the properties of the manufactured chips. Let us recall here that rival Samsung has already started using GAA in its 3nm process. So TSMC is behind in this.

It should also be noted that one wafer produced using 3nm technology will cost around 20 thousand USD at both TSMC and Samsung, and TSMC is planning a further price increase of around 3-6% next year. TSMC is rumored to be using AI systems based on Nvidia products to develop new processes. This should, for example, speed up some calculations, reduce costs and perhaps even speed up the introduction of new products.

Source: Svět hardware by www.svethardware.cz.

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