The Taiwanese semiconductor manufacturer also continues to develop N3E technology to increase its 3nm efficiency.
TSMC announced this week that the first batch of commercial chips manufactured using the N3 (3nm) fabrication process will ship to customers in the first quarter of 2023. The semiconductor company is on track to begin high-volume semiconductor production using the N3 node in the second half of 2022, as expected.
However, the cycle times of modern technologies are becoming extremely long (more than 100 days). Therefore, its customers will receive the chips and pay TSMC in the first quarter of 2023. Previously, many market watchers believed that the company would ship its first 3nm chips in late 2022.
The Taiwanese giant has confirmed that its second-generation N3 technology will continue to use FinFET transistors, but a lot of improvements will be made. Wei, CEO of TSMC, said, “We introduced the N3E as an extension of our N3 family. The N3E will have an improved manufacturing process window with better performance, power and efficiency. Volume production of the N3E is planned to be 1 year after the N3.” said.
N3E, the advanced version of N3, is expected to be released in late 2023 or early 2024. Afterwards, N2 (2nm) transistors based on GAAFET will be introduced to the market. FinFET transistors will be replaced by GAA transistors and produced in a process called “gate all around transistors”.
Source: Technopat by www.technopat.net.
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