Among the news for Intel’s latest processors in the Core 12000 series is the much larger new base LGA 1700. The increased size has proven to be somewhat problematic, as the base’s locking mechanism distributes the pressure unevenly when the processor is mounted. Over time, the heat spreader does not withstand the pressure and bends, which results in an uneven surface and a slightly poorer heat dissipation capacity.
Intel believes that a certain degree of bending is normal, and advises against home-made solutions so as not to risk losing warranty. It does not seem to worry the radiator manufacturer Thermalright, which is now joining the crowd that wants to remedy the curved heat dissipators with an own solution.
Many of the options circulating online involve various 3D-printed designs. Thermalright is investing instead in a metal frame, which has been specially adapted to the LGA 1700 and will help to redistribute the print in a gentler way. It is not clear whether the frame is compatible with other manufacturers’ coolers, however, it must fit all motherboards with control circuit H610, B660 or Z690.
The frame is available in either black or red, but at the time of writing is only available in Taiwan at a price equivalent to just over fifty bucks. Whether the anti-bending frame will be launched in other regions and whether it also violates Intel’s warranty terms remains to be seen.
Source: SweClockers by www.sweclockers.com.
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