Each release of a new generation of iPhone, makes us think about what is to come next. And for upcoming releases, the powerful system signed by Apple could be updated with a major change. Thus, it has been announced by the trusted Apple analyst, Ming-Chi Kuo, in a recent report.
According to Kuo, Apple is “aggressively” testing vapor chamber thermal systems for use on iPhones, which suggests that the technology will make its way to the flagship phone in the near future.
The next thing for the iPhone would be a vapor chamber cooling technology.
The report believes that it is highly likely that Apple will incorporate vapor chamber technology into an upcoming iPhone model, although not it is clear if the system will be ready in time by 2021.
Since although it is not the first time that Apple works on this system for some time, the first solutions have not met the high standards of the company.
How Steam Thermal Technology Works
According to information published by Apple Insider, Vapor Chamber (VC) technology involves the evaporation of a liquid (usually water) within a specialized heat pipe or heat retention structure that works its way through the chassis of a device.
Heat from processors and other high-load electronics causes the liquid to evaporate into a vapor that spreads thermal energy through the evaporation chamber as it travels to areas of lower pressure. The fins or other bodies of the condenser remove heat from the steam, which returns to a liquid state and is transported back to high pressure areas through capillary action.
Given these advantages, Kuo states:
“The rationale for the iPhone not to adopt VC is that the reliability test results cannot meet Apple’s high requirements… Still, we are optimistic about the VC reliability improvement program and hope that at least the high-end iPhone models will be equipped with VC in the near future.
Kuo believes that the iPhone will need vapor chambers to keep up with the rapid adoption of 5G and the increasing thermal loads on the CPU. Since with the recent iPhone 12 it has been confirmed that they get hot when connected to the ultra-fast network. With which, an improved thermal system will increase computing performance and increase component longevity.
Source: iPadizate by www.ipadizate.es.
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