Review of Intel’s 12th Generation Core Processors with New Overclocking Features (Alder Lake)

The new 12th generation Core processors enable overclocking of both P and E cores, new XMP 3.0 DDR5 profiles and, for example, a new Dynamic Memory Boost feature.

The Alder Lake code-named processors, launched today at Intel Innovation, will obey the name of 12th-generation Core processors on the market. With the new platform, memories, and processor architecture, there’s also an exceptional amount of new stuff on the overclocking front this time around.

One of the most significant aspects of overclocking is the efficient removal of heat from the processor itself. Intel has optimized this in its new processors by further lowering the silicon chip itself, and this time the slimming course is also soldered to the silicon chip heat sink (Thin STIM, Thin Solder Thermal Interface Material). The heat spreader, on the other hand, is a thicker material than before. However, the company does not provide any concrete figures on the effects of the change. For 12th generation processors, the height of the entire package with its processor bases has also become lower than before, which affects the mounting of the coolers along with the new mounting screw locations.

The 12th generation Core platform allows overclocking of both the P and E cores separately, with little uncertainty, as in the first overclocking leaks only the clock frequencies of the P cores had been touched. Also new is support for DDR5 memory overclocking, a new Dynamic Memory Boost feature, XMP 3.0 profiles for DDR5 memory, and synthetic internal BCLK clock frequency clocking options.

In the field of overclocking, the new processors have separately adjustable P-core factor, E-core factor, perimeter bus and cache clock frequency, GPU clock frequency, memory clock frequency and Base Clock BCLK clock frequency. In addition, the user can adjust the AVX Offset clock frequencies and turn off the AVX completely, control the Hyper-Threading-SMT technology separately for each P-core, adjust the memory clock frequency on the fly, change the core coefficients per core, and of course adjust the voltages. For more advanced overclockers, Processor PLL-related bypass switches, BCLK-aware adaptive voltage, PCI Express and DMI bus overclocking options, switching cores on or off individually, and TjMax Offset settings are also available.

In addition, the Intel Extreme Tuning Utility has been updated with 12th generation processors to a new version 7.5, which naturally brings support for Alder Lake. XTU’s Intel Speed ​​Optimizer, or ISO, provides one-click overclocking capabilities automatically, although only the Core i9-12900K and i9-12900KF are supported at this point. Other Alder Lake processors will receive ISO support in the upcoming 7.6 version.

On the memory side, of course, there is support for new DDR5 memories in addition to DDR4 memories. As a result, Intel has upgraded the memory’s Extreme Memory Profile, or XMP, to version 3.0, which brings not only DDR5 support, but also general user-friendly features, as well as the ability to control the voltage management now transferred to the memories. With XMP 3.0, the number of memory manufacturer’s own profiles has been increased to three, in addition to which two rewritable memory settings for user adjustment are supported. Memory profiles can now also be given their own descriptive names (max. 16 characters). The new Dynamic Memory Boost Technology, in turn, switches the flight between JEDEC-compliant settings and XMP settings to optimize power consumption. The feature works with both DDR4 and DDR5 memories.

Source: Intel


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