After the 3D Sonic Sensor launched in 2018 and the large “Max” version in 2019, Qualcomm is taking advantage of this CES 2021 to announce its 3D Sonic Sensor Gen 2, its second generation of ultrasonic fingerprint sensor intended to be placed under screens smartphones.
Measuring 8 x 8 mm (64 mm²), this new sensor offers an area 77% larger than that of the first generation which only measured 4 x 9 mm (36 mm²). At only 0.2mm, it’s even thinner than in the past and its read speed is 50% faster. Improvements which should make it possible to erase the errors of youth of the first generation, which in particular had difficulty reading the fingers under the protective films of the screens.
According to several sources, the first terminal integrating Qualcomm’s 3D Sonic Sensor Gen 2 could be Samsung’s Galaxy S21, the Korean manufacturer being one of Qualcomm’s biggest customers for fingerprint readers since it has integrated them into all its high-end terminals for two years (Galaxy S10, Note 10, S20 and Note 20).
Source : Qualcomm
Source: Technos – 01net by www.01net.com.
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