Intel invests $ 3.5 billion in 3D chip assembly


Intel is betting on advanced chip assembly and packaging technologies. The world leader in semiconductors announced on May 3, 2021, a multi-year investment of 3.5 billion dollars in this activity, which comes after the manufacture of chip wafers, at its factory in New Mexico, in the United States. United. The effort is particularly beneficial to the in-house 3D chip assembly and packaging technology, called Foveros.

«During the presentation of our new IDM 2.0 strategy in production, we insisted on the fact that assembly and packaging form critical stages in the manufacture of advanced semiconductors, recalls the new CEO of the group Pat Gelsinger in a video. We at Intel have undisputed leadership in this area. We want to make it a strong element of differentiation in the market and a strategic axis of our leadership in production.


Source: UsineNouvelle – Actualités A la une by www.usinenouvelle.com.

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