In recent days, Intel has hosted events, in the form of the developer conference Intel Innovation 2022. Parts of it have been broadcast live, including the opening keynote where both the launch of the Arc A770 and the Core 13000 “Raptor Lake” were revealed. In parallel, it was also possible to participate in physical form in San Jose, California, where hardware was also exhibited to view.
Among the exhibition specimens were, among other things, silicon plates (eng. wafers) containing circuits for “Raptor Lake” processors. When sharp eyes belonging to both Paul Alcorn
from Tom’s Hardware and Dr. Ian Cuttress took a look and discovered that one specimen’s design did not match what Intel had recently launched. In the pictures you can see that the cores are partly not lined up in the same way, and partly there are a total of 34 per circuit. That’s 10 more cores than the 24 cores found in full-fledged “Raptor Lake” circuits.
After discussion with Intel staff about which model the wafer actually contained, a look was taken at the back, where a sticker claimed it to be a model from the “Raptor Lake” family, with the S suffix marking it for desktop computers, followed by 34 kernels. The staff are said to have been somewhat confused about its contents and not least what it did out on the exhibition floor, as no such product has been unveiled at the moment.
In addition to the increased number of cores, they are interconnected in the same way as Intel’s “Ice Lake” family for the server segment. In addition, clusters with energy-efficient cores appear to be missing, which suggests that all 34 are performance cores. The circuit also appears to be larger than what fits in pre-packaged processors adapted for the LGA 1700 socket.
A possible explanation is that it is about rebranded circuits from the server segment’s “Sapphire Rapids” family, which under the “Raptor Lake” flag could conceivably become either a new enthusiast platform (eng. High-End Desktop, HEDT), processors for the category workstation or both parts. There, features from the consumer and server segments meet, like a more generous number of memory channels, cores and PCI Express lanes – features that match what can be seen in the silicon.
Is a new HEDT platform from Intel on your wish list?
Source: SweClockers by www.sweclockers.com.
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