Huawei is no longer allowed to have chips made at the Taiwanese TSMC in connection with the trade ban. That rule has officially been in effect since September, but the chief executive officer has previously confirmed that he is working on a final system-on-a-chip in the Kirin 9000 series. Now the Chinese is writing IT Home that they will end up in the Huawei P50 and Mate 50 smartphones.
The HiSilicon Kirin 9000 chips are also included in the Mate 40 Pro devices last October. It is not clear how many different soc’s it goes, right now we only know of the existence of the Kirin 9000 5G and the Kirin 9000E 5G. Both are made on a 5nm node, probably TSMC’s.
The development of future smartphones in the P and Mate series would not have been stopped, according to IT Home. Even if the Mate 40 series were to be sold out, Huawei still has to have a significant part of the Kirin 9000 chips for new devices. IT Home says there are 8 million Kirin chips, although it is not clear whether it is the original number or the number reserved for the P50 and the Mate 50.
The alleged design of the Huawei P50 (Pro), from the Dutch LetsGoDigital.
The P50 should have two different display versions according to IT Home sources, one has a 90Hz refresh rate, the second goes up to 120Hz. There would be a hole in the display for the camera. On the back is still a camera setup developed in collaboration with Leica and it should be comparable to the cameras of the Mate 40. One important difference is that the optical zoom range has been increased to 200x.
Wired, the P50 devices must be able to fast charge with 66 watts. A charging capacity of a hefty 135 watts is still being considered, but this requires extra consideration of the battery life and energy density. Wireless charging is possible with 50 watts. Hongmeng OS 2.0 would not be installed yet, instead it must be Huawei’s Emui 11 shell based on Android 10. The Mate 40 would also be slightly thinner.
Source: IT home
Source: Hardware Info Compleet by nl.hardware.info.
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