Industry association SEMI predicts that the semiconductor industry will build nearly 30 new factories this year and next to meet the steadily increasing demand. Construction of 19 new chip factories will start this year, with ten more to follow in 2022. Of these, 8 will each be in China and Taiwan, 6 in the US, three for Europe and the Middle East combined, and two more per country for Japan and South Korea. Only four of the plants are dedicated to dram and flash memory, for Samsung, SK Hynix, Micron and Kioxia/Toshiba.
This number could increase as many companies are currently planning these fabs on quite short notice. This is because many countries and international communities have set up funding programs to better position their own locations. SEMI lists eight projects until the end of next year that have not yet been confirmed but could appear in the planning in the short term. Quite a few major manufacturers, including GlobalFoundries, TSMC, Samsung and Intel, are building or planning to build new factories.
The estimated cost of $140 billion to equip all 29 factories shows that there will be many smaller factories. As the report lists 22 factories in the 300mm wafer class, seven more are being built for 200, 150 or even 100mm wafers. Ultimately, the result should be the equivalent of 2.6 million additional 200mm wafers per month, which is nearly the monthly production of foundry TSMC.
Source: Hardware Info Compleet by nl.hardware.info.
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