The latest processor generation from AMD is the Ryzen 5000 with the architecture Zen 3, which was launched in the autumn of 2020. By the end of the year or the beginning of 2022, AMD will top the architecture with a tripling in L3 cache with promises of real performance increases in games. The next step is spelled Zen 4 and here significant architectural improvements are to be expected.
In recent times, more and more information about Zen 4 and the processor family “Raphael” has found its way onto the web. Now Gamers Nexus publishes details they have been brooding on for over a year, but until now have not been able to verify. These are official images from a presentation that is not intended for the public eye, but has probably been used internally and vis-à-vis partner manufacturers.
The first detail is about AMD’s new Core Chiplet Die (CCD), ie the circuit that houses the architecture itself with associated cores. The production takes place on a 5-nanometer technology and the number of Zen 4 cores is eight in number, while the amount of L3 cache is 32 MB. Today’s CCD circuits house the same number of cores and amount of L3 cache, but then of the architecture Zen 3 and manufacturing of 7 nanometers.
Like today’s Ryzen 5000 series, a finished processor can house up to two CCD circuits for a total of 16 cores and 64 MB of L3 cache. These are connected to a new IO-Die (IOD), which handles all forms of input/output. This includes everything from USB to SATA, PCI Express and the memory channels, which in addition to supporting today’s DDR4 primary memory can also be used with future DDR5.
One of the big news with the new IOD circuit will be an integrated graphics part. This is not directly intended for gaming, but should, like Intel’s diton, allow for use and connection to screens without the need for a dedicated graphics card. The integrated graphics part must be able to be used together with up to four screens via the HDMI and Displayport connections.
IOD circuits also take a manufacturing step down. The IOD circuit used with today’s Zen 3 processors and the predecessors with Zen 2 is manufactured on a 12-nanometer technology from Globalfoundries. The new solution is manufactured on 6 nanometers from TSMC and is a refinement of the company’s 7-nanometer technologies.
AMD “Raphael” takes place in the new socket LGA 1718 and support for DDR5 memory, and if the information above is correct, there is also backward compatibility for DDR4. This probably means that there will be two sets of motherboards from manufacturers – more affordable models with DDR4 connections and more lavish DDR5 variants for enthusiasts.
A complete processor with up to two CCD circuits and an IOD circuit should, according to Gamers Nexus, over a year old data be up to 105 W. Worth noting is that newer findings speak of 120 W and according to the Youtube channel itself it is not unlikely to be the case. Last year, AMD probably had no ready-made circuits and what was communicated then would in that case have been qualified guesses.
[Given] the maturity of the x86 architecture now, the answer has to be, kind of, all of the above. If you looked at our technical document on Zen 3, it was this long list of things that we did to get that 19% [IPC gain]. Zen 4 is going to have a similar long list of things, where you look at everything from the caches, to the branch prediction, [to] the number of gates in the execution pipeline. Everything is scrutinized to squeeze more performance out. – Rick Bergman, chef för AMD:s division Computing and Graphics
While much is now known about the platform itself, it is nonetheless known about the Zen 4 architecture. The only concrete thing to go on is an earlier statement by AMD’s head of Computing and Graphics, Rick Bergman, who claimed that Zen 4 should bring about similar improvements as Zen 3 made to Zen 2. Rumor has it that there is an increase in performance at the same clock frequency (IPC) of 25 percent for Zen 4 compared to Zen 3, whose increase compared to Zen 2 is 19 percent.
AMD “Raphael” will be launched sometime in 2022 and may be delayed until later in the year. This is when AMD towards the end of the year goes into production with one refresh of Ryzen 5000, where AMD with stacking of circuits triples the amount of L3 cache for the top models from 64 to 192 MB.
Read more about AMD’s architecture Zen 4:
Source: SweClockers by www.sweclockers.com.
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